• SERVER MB C622 S3647 MATX/MBD-X11SPM-TF-O SUPERMICRO

SERVER MB C622 S3647 MATX/MBD-X11SPM-TF-O SUPERMICRO

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Ikmēneša maksājums no 34.93 €
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SKU: 1278631 EAN: 672042282616

Apraksts

Key Features

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP

Intel® C622 chipset

Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)

Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)

M.2 NGFF connector
M.2 Interface: PCI-E 3.0 x4
Form Factor: 2242, 2280
Key: M-Key

2 10GbE LAN ports

12 SATA3 (6Gbps) via C622

Supports 12V DC power input

5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

I/O: 1 VGA, 2 COM, TPM header

Parametri

Garantija (mēneši): 12
Ražotājs: SUPERMICRO
Ražotāja kods: MBD-X11SPM-TF-O
Svars: 2 kg
Chipset: Intel C622
Socket: S3647
CPUs: Xeon Scalable
Maximum number of CPUs: 1
Form Factor: MicroATX
Memory type: DDR4
Frequency speed: 2666/2933 MHz
Memory features: LRDIMM/RDIMM
Memory slots: 6
Integrated LAN: 10 Gigabit
RAID: SATA 0, 1, 5, 10
Included Accessories: 4x SATA CBL-0044L IO shield
Shipping box quantity: 1
Unit Brutto Volume: 0.004872 cubm
Unit Net Weight: 1 kg
Unit Box Width: 0.29
Unit Box Length: 0.28
Unit Box Height: 0.06
Expansion slots
PCI-Express 3.0 8x: 1
M.2: 1
PCI-Express 3.0 16x: 2
Input/Output connectors
RJ45: 3
USB 3.0: 3
USB 2.0: 2
15pin D-sub: 1
COM: 1
Shipping/Package Box Dimensions
Shipping Box Depth: 28 cm
Shipping Box Height: 6 cm
Shipping Box Weight: 2 kg
Shipping Box Width: 29 cm